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The epitaxial growth of SrTiO 3 on Si(100) substrates that have been lithographically patterned to realize deposition-last, lithographically defined oxide devices on Si is explored. In contrast to traditional deposition-last techniques which create a physical hard mask on top of the substrate prior to epitaxial growth, a pseudomask is instead created by texturing the Si substrate surface itself. The Si is textured through a combination of reactive ion etching and wet-etching using a tetramethylammonium hydroxide solution. Desorbing the native SiO x at high temperatures prior to epitaxial growth in ultrahigh vacuum presents no complications as the patterned substrate is comprised entirely of Si. The inverted profile in which the epitaxial oxide device layer is above the textured pseudomask circumvents shadowing during deposition associated with conventional hard masks, thereby opening a pathway for highly scaled devices to be created.